Laser Center combined laser cutting and engraving technologies in one laser system, which allows both creating topologies and cutting components.
The MicroSET laser system is designed to pierce holes with high precision, create depressions, channels and mesostructures, as well as cut various components of complex shape from all major ceramic materials used in radio electronics.
Modern trends in electronic technology require new materials and fundamentally new miniature products.
Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.
Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.
About the experience of our company in this area: