Cutting of electronic components

Specialists of the Laser Center have developed laser systens and technologies for precision cutting of items for spectroscopy and other applications.

During manufacturing, electronic components are often combined into an array of elements placed on a single substrate or base. The density of distribution is very important. Laser technologies ensure a high density of components while reducing the distance between the elements. RX laser system provides minimal cutting width and high accuracy, and using it can significantly increase the efficiency of electronic componenets production.